| 摘要 |
PURPOSE: An electroplating composition for plating micropattern or microhole is provided, which helps micropattern and microhole plated uniformly on PCB. CONSTITUTION: The electroplating composition for plating micropattern or microhole is characterized in that it contains sulfonate compounds with at least one radical for fluorine substitution and the sulfonate compounds are alkane sulfonate represented by formula I, cycloalkane sulfonate represented by formula II and phenol sulfonate represented by formula III or their derivatives. In the formulae, R1, R2, R3, R4, R5, R6 and R7 denote F, H, CpH2p+1 or CpF2p+1, respectively (p is an integer of 1 to 4) wherein at least one among R1 to R5 is F and at least one between R6 and R7 is F; A denotes alkali metal, alkaline earth metal, hydrogen or -NB1B2B3B4, respectively wherein B1, B2, B3 and B4 denote hydrogen, alkyl, aryl or aralkyl; and n is an integer of 0 to 18.
|
