| 摘要 |
PROBLEM TO BE SOLVED: To easily manufacture an interposer for a contactless IC medium without need of heat resistance allowing using a sheet with low heat resistance of paper or synthetic resin such as PVC or PET. SOLUTION: Thermosetting conductive ink is printed and hardened on a release sheet 10 with high heat resistance to form opposite lands 5, 7a, 7b and a jumper part 8. Thermosetting insulation ink is printed and cured in such a manner covering the jumper part 8 to form a resist part 6. An IC chip 9 is mounted so as to be connected with the opposite lands 7b, 5. An adhesive sheet 11 with low heat resistance is closely contacted with the sheet 10 and torn off again, and the opposite lands 5, 7a, 7b the resist part 6, the jumper part 8 and the IC chip 9 are integrally transferred to an adhesive face of the adhesive sheet 11. The interposer 4 manufactured in such a manner is adhered to a sheet material 1 having an antenna 3 in a plurally wound coil shape and land parts 2a, 2b to finally form the contactless IC medium. |
