JIG FOR SPINNER, SPINNER AND SPIN COATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a spinner, a spin coating method and a jig for spinner in which a liquid resin coating plane of uniform film thickness can be obtained even when spin coating is performed at a relatively low rotational speed using a high viscosity liquid resin. SOLUTION: The jig for spinner comprises a base body part 11 and a frame part 12. A semiconductor substrate (wafer) 31 is placed in its recess and the jig for spinner is vacuum-sucked to the rotating plate 21 of a spinner through a vacuum exhaust tube 25. When the rotating plate 21 is rotated at a low speed and the surface of the semiconductor substrate (wafer) 31 is coated with the high viscosity liquid resin (photoresist), the photoresist 33 is spread and a raised part thereof is formed on the upper surface at the frame part 12 of the jig for spinner. Consequently, the photoresist coating plane on the semiconductor substrate (wafer) 31 has a uniform thickness.