| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an aligner being used in a lithography process for a compound semiconductor wafer in which the compound semiconductor wafer is not cracked easily even upon contact with a mask. SOLUTION: The aligner comprises a holder 13 for holding a mask M, and a section 12 for holding a compound semiconductor wafer W. In order to buffer a pressing force being applied to the compound semiconductor wafer W from the mask M upon contact, the compound semiconductor wafer W is held on the wafer holding section 12 through a buffering member, i.e., a rubber sheet 15 as a resilient member.</p> |
