| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring circuit board that can be made compact by more thinly forming its thick portion on which wiring can be formed at a high density, and to provide a method of manufacturing the circuit board. SOLUTION: After a first substrate 24 is formed by respectively laminating first and second metal foil 21a and 22b upon both surfaces of a first insulating layer 22a, the metal foil 21a and 22a are formed in prescribed conductor patterns. Then the second insulating layer 22b of a second substrate 26 and the third insulating layer 22c of a third substrate 27 separately formed from the substrate 26 are respectively laminated upon the first and second metal foil 21a and 22b through first and second adhesive layers 28 and 29. Thereafter, the thin portions 30 of the third metal foil 21c of the second substrate 26 and fourth metal foil 21d of the third substrate 27 are removed and, at the same time, the thick portions 31 of the foil 21c and 21d are formed in prescribed conductor patterns. |
