发明名称 MULTI-LAYERED PRINTED CIRCUIT SUBSTRATE
摘要 PURPOSE: A multi-layered printed circuit substrate is provided to form a capacitor having low capacitance without an additional element by forming an input pattern, an output pattern, and a ground pattern on each layer of laminated copper foil plates and connecting the patterns to each other. CONSTITUTION: A multi-layered printed circuit substrate is formed by laminating the first, the second, and the third copper foil lamination plates(110). An input pattern(111), an output pattern(121), and a ground pattern(131) are laminated on the first, the second, and the third cooper foil lamination plates(110). The input pattern is serially connected to the output pattern(121). The ground pattern(131) is connected in parallel therebetween and a capacitor value is formed among each pattern(111,121,131). The input pattern(111), the output pattern(121), and the ground pattern(131) are formed by patterning coils(L) and condensers(C) and connecting them to each other.
申请公布号 KR20020076695(A) 申请公布日期 2002.10.11
申请号 KR20010016761 申请日期 2001.03.30
申请人 PARTSNIC CO., LTD. 发明人 KIM, JONG GWAN
分类号 H05K1/16;(IPC1-7):H05K1/16 主分类号 H05K1/16
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