发明名称 MULTI-BANK MEMORY SUBSYSTEM EMPLOYING AN ARRANGEMENT OF MULTIPLE MEMORY MODULES
摘要 <p>A multi-bank memory subsystem employing multiple memory modules. A memory subsystem includes a memory controller coupled to a memory bus. The memory bus includes a plurality of data paths each corresponding to a separate grouping of data lines. The memory bus is coupled to a first plurality of memory modules corresponding to a first memory bank. The first memory bank corresponding to a first range of addresses. The memory bus is also coupled to a second plurality of memory modules corresponding to a second memory bank. The second memory bank corresponding to a second range of addresses. A separate memory module of each of the first and the second memory banks is coupled to each data path of the memory bus. Memory modules that are coupled to the same data path are located adjacent to one another without any intervening memory modules coupled to other data paths.</p>
申请公布号 WO2002080002(A2) 申请公布日期 2002.10.10
申请号 US2002010563 申请日期 2002.03.29
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