发明名称 ELECTROLYTIC PLATING TANK
摘要 <p>An electrolytic plating tank capable of applying a plating of uniform thickness, characterized by comprising a first tank (21) having an anode (22) disposed therein and being enclosed, a second tank (24) provided adjacent to the first tank (21) and having a cathode (25) disposed therein, a pump (26) for force-feeding plating liquid to the first tank (21), and a nozzle (30) installed in a partition wall (31) located between the first tank (21) and the second tank (24), formed of a number of tubular bodies (32) having a specified length and positioned parallel with each other, feeding the plating liquid fed to the first tank (21) to the second tank (24) through the tubular bodies (32), and causing a liquid flow in the plating liquid contained in the second tank (24).</p>
申请公布号 WO2002079548(P1) 申请公布日期 2002.10.10
申请号 JP2001002603 申请日期 2001.03.28
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