发明名称 |
Diamond heat spreading and cooling technique for integrated circuits |
摘要 |
A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.
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申请公布号 |
US2002145194(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
US20010828617 |
申请日期 |
2001.04.06 |
申请人 |
INTEL CORPORATION |
发明人 |
O'CONNOR MICHAEL;HALEY KEVIN J.;SUR BISWAJIT |
分类号 |
H01L23/373;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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