发明名称 Sic single crystal, method for manufacturing sic single crystal, sic wafer having an epitaxial film, method for manufacturing sic wafer having an epitaxial film, and sic electronic device
摘要 A refined SiC single crystal that includes a small number of defects is provided as follows. At a first growth step, a first seed crystal is formed from a crude SiC single crystal, and a first grown crystal is formed on a first growth surface, which is a plane having an inclination of 20 degrees or smaller from a {1-100} plane or an inclination of 20 degrees or smaller from a {11-20} plane. At an intermediate growth step, an n growth crystal is formed on an n growth surface, which is a plane having an inclination of 45 to 90 degrees from an (n-1) growth surface and an inclination of 60 to 90 degrees from a {0001} plane. At a final growth step, a final SiC single crystal is formed on a final growth surface, which has an inclination of 20 degrees or smaller from a {0001} plane.
申请公布号 SE0202992(D0) 申请公布日期 2002.10.10
申请号 SE20020002992 申请日期 2002.10.10
申请人 DENSO CORP 发明人 DAISUKE NAKAMURA;TADASHI ITO;HIROYUKI KONDO;MASAMI NAITO
分类号 C30B23/00;C30B25/00;C30B25/20;C30B33/00 主分类号 C30B23/00
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