PHOTOSENSITIVE FILM FOR CIRCUIT FORMATION AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

摘要

A photosensitive film for circuit formation which comprises a first film (base film) and formed thereon either a photosensitive layer having a thickness of 0.1 to 10 mu m or a photosensitive layer having a thickness of 0.1 to 14 mu m and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)-propane.