A micro wave plasma processing device, wherein a tapered surface for relieving a variation in impedance and a member having an intermediate dielectric constant are installed between a micro wave feeding wave guide and a micro wave antenna, whereby the formation of reflected wave at the connection part between the micro wave feeding wave guide and the micro wave antenna can be suppressed to increase a power feeding efficiency and suppress discharge so as to stabilize the formation of plasma in the plasma processing device.
申请公布号
WO02080250(A1)
申请公布日期
2002.10.10
申请号
WO2002JP03109
申请日期
2002.03.28
申请人
OHMI, TADAHIRO;TOKYO ELECTRON LIMITED;HIRAYAMA, MASAKI;SUGAWA, SHIGETOSHI;GOTO, TETSUYA