发明名称 |
Non-arsenic N-type dopant implantation for improved source/drain interfaces with nickel silicides |
摘要 |
Disadvantageous roughness of interfaces between electrically conductive NiSi layers and n-doped Si interfaces arising during conventional salicide processing for forming shallow-depth source and drain junction regions of NMOS transistors and/or CMOS devices is avoided, or at least substantially reduced, by substituting implanted non-As-containing n-type dopant ions, such as P and/or Sb ions, for the conventionally utilized implanted As n-type dopant ions. If desired, shallow-depth source and drain extensions may be formed by implantation of As-containing n-type dopant ions above the region comprising the non-As-containing dopant ions without causing roughness of the NiSi/n-doped Si interface.
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申请公布号 |
US2002146904(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
US20010813308 |
申请日期 |
2001.03.21 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BUYNOSKI MATTHEW S.;XIANG QI;BESSER PAUL R. |
分类号 |
H01L21/265;H01L21/285;H01L21/336;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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地址 |
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