| 摘要 |
<p>One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges (40, 42). Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses (72) distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structues for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes electrostatically acutated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed MEMS mirror array packaging. Other embodiments are directed to electrostatically acutated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structues in MEMS devices. Other embodiments are directed to methods of depositing a thin film an the back of MEMS device.</p> |
