| 发明名称 |
Method to reduce number of wire-bond loop heights versus the total quanity of power signal rings |
| 摘要 |
A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.
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| 申请公布号 |
US2002145193(A1) |
申请公布日期 |
2002.10.10 |
| 申请号 |
US20020157505 |
申请日期 |
2002.05.29 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BEAULIEU FREDERIC;KUZAWINSKI MARK J.;MAINVILLE STEPHANE;OUIMET SYLVAIN;QUINTAL JEAN-GUY;ROBICHAUD GUY |
| 分类号 |
H01L21/60;H01L23/31;H01L23/498;H01L23/50;(IPC1-7):H01L23/52;H01L23/22;H01L23/24 |
主分类号 |
H01L21/60 |
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