发明名称 |
Transfer mold semiconductor packaging processes, circuit substrates, semiconductor packages, and ball grid arrays |
摘要 |
In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
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申请公布号 |
US2002145208(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
US20010827017 |
申请日期 |
2001.04.05 |
申请人 |
KINSMAN LARRY;WENSEL RICHARD;REEDER JEFF |
发明人 |
KINSMAN LARRY;WENSEL RICHARD;REEDER JEFF |
分类号 |
H01L21/56;H01L23/31;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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