BONDING PAD FOR FLIP-CHIP FABRICATION

摘要

A flip-chip bonding system. In flip chip bonding, a planar array of metallic pads (P) is bonded to a mirror image array (P) by a film (F) of solder between each pad-pair. Prior to bonding, testing may be done, by applying a mechanical probe (PR) to the pads (P), and reading, or applying, electrical signals. The probe (PR) may damage very small pads (P). Under the invention, small pads (3) are configured in two parts, connected together. One part (6) is used for probing, and the other (9) is used to make the solder connection.