Stacked electronic component device has perpendicular pins providing mechanical and electrical connections between stacked electronic components

摘要

The device has a stack of electronic components, each having a wiring plate (10) mounted on a semiconductor chip (4), mechanically and electrically coupled together and to a carrier plate (34) via pins (32) extending perpendicular to the major surfaces of the electronic components. An Independent claim for a method for manufacture of a device with at least 2 stacked electronic components is also included.