| 摘要 |
A composite heat-dissipating structure applied in a circuit board is disclosed. The composite heat-dissipating structure includes a first heat-dissipating element connected to a heat-generating device, and a second heat-dissipating element detachably connected to the first heat-dissipating element, wherein the selection of the first and second heat-dissipating elements is dependent on a heat-generating rate of the heat-generating device and a particular space limitation for achieving a heat-dissipating effect.
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