发明名称 |
Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces, as in the electrodeposition of semi-conductor wafers and the like and for other wet processing techniques and workpieces |
摘要 |
A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an elastomeric encased ring of flexible fingers against which the periphery of the workpiece underside is forced to deflect the fingers downwardly and engage a peripheral sealing bead against the underside periphery of the workpiece; and where electrical contact with the workpiece is desired, resiliently engaging electrical contact tips protruding through peripheral openings in the elastomeric covering within the sealing ring, with the underside periphery of the workpiece.
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申请公布号 |
US2002144900(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
US20010827084 |
申请日期 |
2001.04.05 |
申请人 |
ALL WET TECHNOLOGIES, INC. |
发明人 |
KEIGLER ARTHUR |
分类号 |
C25D7/12;C25D17/06;H01L21/00;(IPC1-7):C25D17/04;F16J15/02 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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