发明名称 HEAT INSULATING BOARD OF INDUCTION HEATING APPARATUS
摘要 <p>A heat insulating board of an induction heating apparatus disposed inside an induction heating coil and shielding a radiant heat from a heated material fed through the inside of the induction heating coil, comprising a cooling tube formed with high heat conductive monothilic refractory with a heat conductivity of 5 W/(m °C) or higher and a closed in the monothilic refractory, whereby deformation and damage resulting from heat can be reduced remarkably.</p>
申请公布号 WO2002080622(P1) 申请公布日期 2002.10.10
申请号 JP2002003178 申请日期 2002.03.29
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