| 摘要 |
<p>First conductors (1-9) formed on an upper wiring layer (100) and second conductors (11-18) formed on a lower wiring layer (300) are connected in a coil form with third conductors (contact sections) (21-36) formed on an intermediate layer (200) interposed. Thus, a closed magnetic path is constituted of itself to realize a large inductance value (L) by suppressing a leakage magnetic flux, and to reduce a magnetic interference with an external circuit is reduced. An eddy current loss generated by the application of the leakage magnetic flux on a semiconductor laminated board is reduced to realize a very high quality coefficient (Q) value.</p> |
