发明名称 THERMOFORMABLE PACKAGING FILM
摘要 <p>This invention is directed to a thermoformable film comprising a composite structure of at least three layers firmly adhered to one another, a top and bottom layer and an inner layer;wherein the top and bottom layer of the composite structure comprise a film layer of an ethylene vinyl acetate copolymer comprising 1 to 25% by weight, based on the weight of the copolymer, of a polymerized vinyl acetate and 75 to 99% by weight, based on the weight of the copolymer, of polymerized ethylene and the inner layer of the composite structure comprises a film of a polymer blend of the following: (a) 40 to 95% by weight, based on the weight of the polymer blend, of an ethylene based copolymer comprises repeating polymerized units of (1) at least 50% by weight, based on the weight of the copolymer, of ethylene,(2) 1 to 30% by weight, based on the weight of the copolymer, of acrylic acid or methacrylic acid; and (3) up to 40% by weight, based on the weight of the copolymer, of an alkyl acrylate or an alkyl methacrylate,wherein the copolymer has 5 to 100% of the acid groups neutralized with metal ion selected from the following group: zinc, magnesium, sodium and lithium; and (b) 5 to 60% by weight, based on the weight of the polymer blend, of a metallocene catalyzed polyethylene; other thermoformable film constructions, such as, a 2 layer construction and constructions greater than 3 layers, such as 5 layers, and a mono layer of the film of a blend of the ethylene based copolymer and the metallocene catalyzed polyethylene also are part of this invention.</p>
申请公布号 WO02078885(A1) 申请公布日期 2002.10.10
申请号 WO2002US10043 申请日期 2002.03.28
申请人 E.I. DU PONT DE NEMOURS AND COMPANY 发明人 GLICK, WILLIAM, J.;LEE, I-HWA
分类号 B65D1/00;B32B27/28;B32B27/32;B65D65/40;C08L23/04;C08L23/08;C08L23/26;(IPC1-7):B23B27/32;C08J5/18 主分类号 B65D1/00
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