发明名称 THERMOSETTING ADHESIVE
摘要 <p>A thermosetting adhesive which produces no foul odor or discharged gas, or form no bubbles under irradiation, and which exhibits a satisfactorily high bonding property, even under low-dose irradiation. The thermosetting adhesive contains an ethylene-glycidyl (meth)acrylate copolymer, whose principal monomer components are an ethylene and a glycidyl (meth)acrylate, and a sulphonium salt-comprising cationic polymerization catalyst.</p>
申请公布号 WO2002079338(A2) 申请公布日期 2002.10.10
申请号 US2002008802 申请日期 2002.03.21
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