| 摘要 |
A composite thermal interface pad (74) is comprised of a template portion (76) formed from a material such as thermal gap pad material or thermal tape, in which cavities have been formed and filled with a pliable non-resilient material, such as thermal grease or thermal putty. The spacing and size of the cavities may be tailored to achieve desired elastic properties and stress distributions, as well as optimise the thermal characteristics of the thermal interface with respect to heat distribution patterns of electronic components (66-72) being cooled. The composite thermal interface pad may also be used to provide EMI shielding along the gap formed between the electronic component and the adjacent cooling structure by filling closely adjacent cavities with electrically conductive non-resilient material. In one embodiment. an adjacent structure is provided with projection features that dig into the non-resilient material, thereby ensuring a good thermal interface, increasing the surface area available for thermal transfer, and minimising the distance between the electronic component and the adjacent structure used for cooling. |
