发明名称 HEAT DISSIPATION SYSTEM FOR HIGH POWER LED LIGHTING SYSTEM
摘要 <p>A high power LED lamp device includes a high power LED, a die for supplying electrical power to the LED, a heat sink secured to the die, and a housing between the heat sink and an external environment. Heat within the die is conducted to the heat sink. The housing conducts the heat received from the heat sink to the external environment.</p>
申请公布号 WO2002080289(A1) 申请公布日期 2002.10.10
申请号 US2002009917 申请日期 2002.03.29
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