发明名称 |
Entfernen einer Handhabe für das Scheibenabtrennen und Halteeinrichtung dafür |
摘要 |
A method of separating a slice (W) base mounting member (C) such as a carbon member from sliced wafers (W), and a jig (1) which is used in the method, are disclosed. The method comprises the steps of: supporting a plurality of wafers (W) having their slice base mounting members in a stacked state preferably in jig (1) and separating the slice base mounting members (C) from the stacked wafers (W). Typically the separation is performed after a soaking step in a separating liquid and preferably after subjecting them to a shock wave generated by ultrasonics or compressed air. The mounting member (C) is preferably urged in a direction in the plane of the wafers (W) away from the wafers. <IMAGE> |
申请公布号 |
DE69526772(T2) |
申请公布日期 |
2002.10.10 |
申请号 |
DE1995626772T |
申请日期 |
1995.10.24 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
KABAYASHI, MASAYUKI;SHIMOYAMA, SHIGETOSHI;MIURA, NAKAJI |
分类号 |
H01L21/673;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/673 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|