| 摘要 |
Disclosed is an electronics packaging systems, which provides for a high density assembly of groups (2a, 2b, 2c, 2d) of similar solid state part packages. The system provides a novel method which includes the use of interconnect members (5) and crossover members (8) for interconnecting the signal paths, structurally assembling and supporting the parts (2a, 2b, 2c, 2d), and removing heat generated within the components (1). The system approach disclosed typically starts at the level of assembling pre-packaged parts (2a, 2b, 2c, 2d) into modules, and permeates through to the printed circuit board (6, 9) and box levels of assembly. The system is applicable, but not limited to, solid state memory device packaging, which typically consists of many similar parts interconnected in a matrix bus type configuration. The assembly of a building block of numerous memory components allows for the modular construction of large amounts of solid state memory. |
