| 摘要 |
<p>An invention is provided for a platen (110) for use in a CMP system. The platen (110) is arranged below a linear polishing pad (102) and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen (110) includes a leading zone containing a first plurality of output holes where the leading zone oriented more proximate to an upstream region of the linear polishing pad (102). The platen (110) also includes a trailing zone containing a second plurality of output holes where the trailing zone is oriented more proximate to a downstream region of the linear polishing pad (102). The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.</p> |
