发明名称 ALKOXY GROUP-CONTAINING SILANE MODIFIED POLYAMIC ACID RESIN COMPOSITION AND POLYIMIDE-SILICA HYBRID CURED MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain an alkoxy group-containing silane modified polyamide acid resin composition capable of providing a cured material having excellent mechanical strength and heat resistance, and a transparent polyimide-silica hybrid cured material having excellent heat resistance, mechanical strength and insulation properties and causing no warpage, nor crack. SOLUTION: This silane modified polyamic acid resin composition is characterized by comprising an alkoxy group-containing silane modified polyamide acid resin obtained by reacting a polyamic acid with an epoxy group-containing alkoxysilane partial condensate prepared by subjecting an epoxy compound containing one hydroxy group in one molecule and an alkoxysilane partial condensate to a dealcoholization reaction and a polar solvent.
申请公布号 JP2002293933(A) 申请公布日期 2002.10.09
申请号 JP20010238729 申请日期 2001.08.07
申请人 ARAKAWA CHEM IND CO LTD 发明人 AIDA HIDEKI;TONO TETSUJI
分类号 C08K3/36;C08G73/10;C08L79/08;C09D179/08;C09J179/08;H01L21/312;H01L21/60;H05K1/03;(IPC1-7):C08G73/10 主分类号 C08K3/36
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