| 摘要 |
PROBLEM TO BE SOLVED: To provide an auxiliary magnetic pole in a sputtering apparatus, which can easily change a shape of the magnetic field. SOLUTION: The sputtering apparatus having one or several magnetron-type sputter evaporation sources 3 and one or several auxiliary magnetic poles 9 so as to surround an article 2 to be deposited, in a chamber 1, is characterized by having an angle changing mechanism for changing the angle of the above auxiliary magnetic poles 9 against the above article 2 to be deposited, in order to change the shape of the magnetic field formed by the above magnetron-type sputter evaporation sources 3 and the above auxiliary magnetic poles 9.
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