| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, excellent in hot strength, excellent in adhesion with various kinds of members such as a semiconductor device and a lead frame, excellent in a soldering resis tance in mounting parts on a substrate, particularly in the soldering resistance at higher soldering temperature than conventional, and excellent in adhesion of Ni-Pd, Ni-Pd-Au, etc., with a preplating frame. SOLUTION: The epoxy resin composition for sealing the semiconductor is essentially composed of (A) an epoxy resin, (B) a phenol resin, (C) a compound shown by general formula (1) or the hydrolyzed compound thereof, (D) an inorganic filler and (E) a curing promoter.
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