发明名称 THERMOSETTING RESIN MOLDING MATERIAL AND MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a molding material obtained by making electroconductivity compatible with moldability which are difficult in a thermosetting resin molding material comprising a large amount of a graphite substrate and capable of improving the moldability without deteriorating the electroconductivity by treating the surface of the graphite with a straight-chain saturated fatty acid. SOLUTION: This thermosetting resin molding material comprises a thermosetting resin in an amount of 5-25 wt.% based on the whole molding material and graphite as the substrate in an amount of 75-95 wt.% based on the whole molding material and is characterized in that the graphite is subjected to surface treatment with the 10-32C straight-chain saturated fatty acid.
申请公布号 JP2002294079(A) 申请公布日期 2002.10.09
申请号 JP20010096854 申请日期 2001.03.29
申请人 SUMITOMO BAKELITE CO LTD 发明人 FUJII SHUNSUKE
分类号 C08L101/00;C08K9/04;H01B1/24;H01M8/02 主分类号 C08L101/00
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