| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical element package board which can be used as a board for receiving modules for wavelength multiplexing, can be miniaturized and thinned by dispensing with temperature control and of which the component is easily mounted on the board and easily produced. SOLUTION: The optical element package board has an optical input and output part provided on one principal surface of a transparent board 5, and an optical transmission/processing part where a plurality of optical elements 2 to transmit and receive optical signals through optical fibers/are mounted on both the principal surfaces of transparent board 5 so that a the elements 2 alternately reflect the optical signals transmitting through the transparent board 5 to successively transmit and receive the optical signals, and one of the optical elements 2 transmits and receives the optical signals transmitted through the transparent board 5 to and from the optical input and output part. Packaging density is improved because the optical elements 2 can be mounted on a flat surface, thereby carrying out miniaturization and thickness reduction, the temperature control is unnecessary and the component mounting and the component production are also facilitated.
|
