| 摘要 |
PURPOSE: A semiconductor package is provided to intercept a noise and an electromagnetic wave and emit heat generated from a semiconductor chip by adhering a heat-sink to the semiconductor package. CONSTITUTION: A semiconductor chip(10) is mounted in a semiconductor package(100). A bonding pad is arranged along an edge portion of the semiconductor chip(10). A plurality of leads(16) are arranged around the edge of the semiconductor chip(10). The bonding pad of the semiconductor chip(10) is connected with the lead(16) by a wire(14). A heat-sink(12a) is adhered on an upper face of the semiconductor chip(10) by using an adhesive. The heat-sink(12a) is connected with a ground lead(24) of the leads(16). The semiconductor chip(10), the wire(14), and the lead(24) are molded by a resin(18). An upper face of the heat-sink(12a), an upper and a lower face and an outside of the ground lead(24), and a bottom face of the semiconductor chip(10) are exposed to the outside. |
