发明名称 FINE MOVABLE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a fine movable device preventing a movable electrode plate from being stuck to a fixed substrate by additionally forming an adhesion dissolving electrode further on the fixed substrate where a fixed electrode is formed. SOLUTION: In the fine movable device provided with a fixed electrode substrate 8 manufactured by a micromachining technique, where the fixed electrode 80 is formed, and the movable electrode plate 2 attached and connected to a fixed frame 1' through an anchor part 11 and a fracture 21 and displaced in a vertical direction to the fixed electrode substrate 8, the adhesion dissolving electrode 84 is additionally formed other than the fixed electrode 80 on the fixed electrode substrate 8.
申请公布号 JP2002296516(A) 申请公布日期 2002.10.09
申请号 JP20010095841 申请日期 2001.03.29
申请人 JAPAN AVIATION ELECTRONICS INDUSTRY LTD 发明人 MORI KEIICHI
分类号 B81B3/00;B81C1/00;G02B26/08;(IPC1-7):G02B26/08 主分类号 B81B3/00
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