| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive for laminating non-contact IC media which allows no curling of products, shows an excellent heat resistance and adhesion, has an excellent flexibility allowing no peeling off at bending or twisting when used on non-contact IC media and provides highly reliable non-contact IC media. SOLUTION: This adhesive is used for laminating, on a substrate having an IC chip-mounted antenna, other parts of the substrate or other substrates. The adhesive contains an epoxy compound, a hardener and a flexibility- imparting agent. |
