| 摘要 |
PURPOSE: To obtain a composition for forming a film, as a material for the interlayer insulating film in semiconductor devices, which can make a coating film that has low dielectric property and excels in crack resistance, elastic modulus of film, and adhesiveness to a substrate. CONSTITUTION: A composition for forming a film containing an aromatic polyarylene and/or an aromatic polyarylene ether (A), a polyvinylsiloxane (B), and an organic solvent (C).
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