| 摘要 |
PROBLEM TO BE SOLVED: To provide a photo-curing and thermosetting resin composition, excel lent in both bending property and thermal-shock resistance, without deteriorating several properties such as solder heat resistance and thermal degradation of cured film, chemical gold-plating resistance and acid resistance, and to provide a print wiring board using the same composition. SOLUTION: The photo-curing and thermosetting resin composition is composed of (A) a photosensitive prepolymer having two or above unsaturated double bond and one or above carboxylic group in a molecule, (B) a photopolymerization initiator, (C) a diluent, (D) an epoxy compound, (E) polybutadiene having one or above inner epoxide group in a molecule, and (F) polyurethane fine particles, wherein the modulas of elasticity of the cured materials is 500-2,000 MPa at room temperature and the elongation rate is 5-35%. The print wiring board using this composition is provided. |
