| 摘要 |
PROBLEM TO BE SOLVED: To provide a photo-curing and thermoplastic resin composition, capable of giving a cured film excellent in moisture absorption resistance and excellent in pressure-cooker resistance, and capable of coping with high density and surface mounting of a print wiring board, and to provide a cured film thereof. SOLUTION: The composition is composed of (A) an active-energy ray curing resin, (B) polybutadiene having one or above inner epoxide group, (C) a photopolymerization initiator and (D) a photosensitive (meth)acrylate compound. The above (A) the active-energy ray curing resin is obtained by reacting a reaction product of a polynuclea epoxy compound (a) shown by general formula, and a unsaturated group containing monocarboxylic acid (b), with a polybasic acid anhydride (c). (Wherein, X and Y are different aromatic rings, X is a residual group of aromatic ring of an aromatic epoxy compound having two glycyl group in a molecule, Y is a residual group of aromatic ring of an aromatic alcohol having two phenolic hydroxyl group in a molecule, M is a glycyl group, a methyl glycyl group or a hydrogen atom, and n is an integer of 1-20.). |
