| 摘要 |
PURPOSE: A semiconductor package and a method for fabricating the same are provided to reduce a size of the semiconductor package and maximize efficiency of heat emission of a semiconductor chip by using a conductive connection member instead of a gold wire and by a half-etching process for a predetermined region of a lead. CONSTITUTION: A conductive connection member(22) is formed on input/output pads of each semiconductor chip(10). A sawing process for the semiconductor chips(10) is performed. A plurality of leads(12) are located around a chip loading plate(14). A semiconductor chip(10) having the conductive connection member(22) is adhered on the chip loading plate(14) by using an adhesive(18). The conductive connection member(22) is adhered on a half-etched side of the lead(12). An input/output pad of the semiconductor chip(10) is connected the lead(12) by the conductive connection member(22). The semiconductor chip(10), the chip loading plate(14), the lead(12), and the conductive connection member(22) are molded by a resin(24). |
