发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition having remarkably improved uniformity of the plasticizability in injection molding and exhibiting high surface gloss under a broad molding condition required in a structure part and high strength and rigidity, excellent dimensional stability and electrical properties in practical use. SOLUTION: The objective polyamide resin composition is produced by compounding 100 pts.wt. of a polyamide resin with 0.05-10 pts.wt. of an aliphatic bisamide compound and a higher fatty acid metal salt of an amount to satisfy the weight ratio (higher fatty acid metal salt/aliphatic bisamide compound) of 0.5-2 and mixing 100 pts.wt. of the obtained mixture with 25-150 pts.wt. of a particulate inorganic filler.
申请公布号 JP2002294068(A) 申请公布日期 2002.10.09
申请号 JP20010100877 申请日期 2001.03.30
申请人 ASAHI KASEI CORP 发明人 IWAMOTO TAKASHI
分类号 C08L77/00;C08K3/00;C08K5/098;C08K5/20;(IPC1-7):C08L77/00 主分类号 C08L77/00
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