发明名称 Soldering flux for circuit board and circuit board
摘要 There is provided a soldering flux for circuit board, which is designed to be employed on an occasion of soldering electronic parts on a circuit board, the soldering flux being free from any organic solvent which may become a cause for contaminating air atmosphere and being capable of providing an excellent insulating property. This soldering flux comprises; a rosin-based modified resin having an acid value of not less than 100, a nondissociative activator formed of a nondissociative halogenide, and an aqueous solvent containing a volatile basic agent. There is also provided a circuit board having a flux film formed from such a soldering flux.
申请公布号 EP1149661(A3) 申请公布日期 2002.10.09
申请号 EP20010302940 申请日期 2001.03.29
申请人 TAMURA KAKEN CORPORATION 发明人 AKAIKE, SHINICHI;OHNO, TAKAO;SAITO, SHOICHI
分类号 B23K35/363;B23K35/36;H05K3/34 主分类号 B23K35/363
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