| 发明名称 |
Adhesive sheet with conductor bodies for flip-chip mounting |
| 摘要 |
A variable adherence type adhesive layer (3) is formed on a base (2), in which conductive particles (4) are distributed at positions corresponding to the electrodes of a semiconductor integrated circuit. Independent claims are included for the following: (1) Semiconductor device production method; and (2) Semiconductor device. |
| 申请公布号 |
EP1248291(A2) |
申请公布日期 |
2002.10.09 |
| 申请号 |
EP20020252237 |
申请日期 |
2002.03.27 |
| 申请人 |
LINTEC CORPORATION |
发明人 |
YAMAZAKI, OSAMU;EBE, KAZUYOSHI |
| 分类号 |
C09J7/02;H01L21/60;C09J9/02;C09J133/06;C09J163/00;H01L21/56;H01L21/58;H01L21/68;H01L23/10 |
主分类号 |
C09J7/02 |
| 代理机构 |
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代理人 |
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| 地址 |
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