| 摘要 |
The invention relates to a chipcard arrangement with a card-like support, in which a recess is provided, with at least two superimposed semiconductor chips arranged therein. Said chips exchange electrical signals and/or energy, with each other, by means of electrically conducting connectors, whereby the at least two semiconductor chips together have a minimum size of from 20 to 25 mm<2> and the electrically conducting connection is achieved by means of a three-dimensional wiring in the semiconductor chip. |
