发明名称 |
Semiconductor chip and semiconductor device having a chip-on-chip structure |
摘要 |
A semiconductor chip is bonded to the surface of another semiconductor chip with a predetermined gap secured in between. The semiconductor chip has a plurality of bumps formed on the surface thereof facing the other semiconductor chip. The bumps include functional bumps that contribute to electrical connection between the chips and dummy bumps that do not contribute thereto. |
申请公布号 |
US6462420(B2) |
申请公布日期 |
2002.10.08 |
申请号 |
US20000502433 |
申请日期 |
2000.02.11 |
申请人 |
ROHM CO., LTD. |
发明人 |
HIKITA JUNICHI;MOCHIDA HIROO;NAKATANI GORO;SHIBATA KAZUTAKA |
分类号 |
H01L25/18;H01L23/485;H01L23/495;H01L25/065;H01L25/07;(IPC1-7):H01L23/48 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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