| 摘要 |
A method of making a connection component includes providing a removable layer having first and second surfaces and forming vias at spaced apart first locations of the removable layer. A conductive material, such as copper, is deposited over the first surface of the removable layer and in each of the vias to form one or more flexible leads including projections which extend downwardly in the vias toward the removable layer. Each lead includes a first end integrally connected with one of the projections and a second end remote from the first end. A substrate is provided over the conductive material. The removable layer is removed so that the first and second ends of the leads are movable away from one another. As a result, at least first or second ends of the leads are connected to the substrate without using a bonding or welding step.
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