发明名称 |
Double-sided wafer exposure method and device |
摘要 |
A device for creating at least one aligned marking on opposite sides of a semiconductor wafer including a front side and a back side. A wafer receiving support unit including at least a first wafer receiving slot in a first side wall thereof receives a wafer inserted therein. A template positions at least one aligned marking on each of the front side of the semiconductor wafer and on the backside of the semiconductor wafer.
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申请公布号 |
US6460265(B2) |
申请公布日期 |
2002.10.08 |
申请号 |
US19980191720 |
申请日期 |
1998.11.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
POGGE H. BERNHARD;AUSSCHNITT CHRISTOPHER P. |
分类号 |
G03F7/20;G03F9/00;(IPC1-7):G01B3/14 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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