发明名称 |
Method for forming high quality multiple thickness oxide layers by reducing descum induced defects |
摘要 |
A method for forming high quality oxide layers having different thicknesses by eliminating descum induced defects is disclosed. A semiconductor substrate is subjected to reactive ion etching. The semiconductor substrate includes a wafer, an oxide layer on the wafer, a developed photoresist mask on the oxide layer. The oxide layer is then etched, and the remaining photoresist is stripped before another layer of oxide is grown on the substrate.
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申请公布号 |
US6461973(B1) |
申请公布日期 |
2002.10.08 |
申请号 |
US20000535256 |
申请日期 |
2000.03.23 |
申请人 |
ADVANCED MICRO DEVICES, INC.;FUJITSU LIMITED |
发明人 |
HUI ANGELA T.;OGURA JUSUKE |
分类号 |
H01L21/3065;H01L21/28;H01L21/311;H01L21/316;H01L21/8234;H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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