发明名称 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser processing apparatus and a laser processing method capable of efficiently performing manufacture of a three dimensional structure and a large area. SOLUTION: The laser processing method including a process to delimitate a pattern by controlling plural shutters aligned two-dimensionally, a process to perform processing by irradiating laser light for processing which is intensity- modulated through plural shutters by which the pattern is delimitated to a workpiece under processing, a process to change a pattern by controlling plural shutters, and a process to further execute processing by irradiating laser light for processing which is intensity-modulated through plural shutters by which the changed pattern is delimitated to the workpiece under processing is provided. A wide area processing is executed by synchronously controlling both a mask by which a pattern is generated and a stage to scan the workpiece. Superposing different patterns in the same position can perform different three-dimensional shaped processing.</p>
申请公布号 JP2002292488(A) 申请公布日期 2002.10.08
申请号 JP20010099032 申请日期 2001.03.30
申请人 SUMITOMO HEAVY IND LTD 发明人 YAMAMOTO JIRO
分类号 B23K26/06;B23K26/073;B23K26/08;(IPC1-7):B23K26/06 主分类号 B23K26/06
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